The photosensitive resin material is a special 3D printing material for SLA rapid prototyping, SLA three-dimensional printing 3D printing molding, also known as liquid photosensitive resin selective curing, usually abbreviated as light curing molding. SLA technology is based on the light curing principle of liquid photosensitive resin. This resin material can quickly undergo cross-linking reaction under the irradiation of a certain wavelength and intensity of ultraviolet light (laser wavelength is in the ultraviolet band, enter 325nm) to produce a cured product.
The materials for photosensitive resin SLA are generally liquid photosensitive resin, such as photosensitive epoxy resin, photosensitive vinyl ether, photosensitive epoxy acrylate, photosensitive acrylic resin and so on. The photosensitive resin is composed of two parts, namely photoinitiator and resin (resin is composed of prepolymer, diluent and a small amount of additives). When the photoinitiator is irradiated by ultraviolet light of a certain wavelength (3oonm-4oonm), it absorbs light energy, changes from the ground state to the excited state, and then generates active free radicals, which initiates the polymerization and curing reaction of the prepolymer and the active monomer; diluent It is mainly used for diluting to ensure that the photosensitive resin has sufficient fluidity at room temperature so that it can flow evenly before making the next layer.
The amount of photoinitiator and diluent has an important influence on the curing speed and curing quality of the photosensitive resin. Within a certain range, increasing the amount of photoinitiator can appropriately speed up the curing speed, but if it exceeds a certain range, continue to increase, and the curing speed will not increase, but decrease; the amount of diluent has a greater impact on the leveling speed of the liquid. If it is too large, the viscosity of the liquid will decrease and the leveling will be good. However, when the amount is too large, the linear molecular chains will be spaced too far apart, and the chance of cross-linking when they meet each other will decrease, which will inevitably affect the curing speed and quality. The proportion of photoinitiator and diluent is appropriate, not only the curing speed is fast, but the curing quality is also better.
The selection of photosensitive resin materials requires the following performance characteristics: rapid curing under the irradiation of a certain frequency of monochromatic light, with a small critical exposure and a large curing penetration depth; the curing shrinkage is small, and the curing shrinkage causes the parts to deform and warp. Curving, cracking, etc., which affect the accuracy of molded parts. Low shrinkage resin is conducive to molding high-precision parts; low viscosity, low viscosity during molding is conducive to resin leveling on the cured layer; low swelling, wet molded parts The swelling in the liquid resin causes the part size to be too large; the rapid prototyping part must have sufficient strength and good surface finish, and be less toxic during molding and so on. Of course, after molding and cleaning, it is non-toxic and pollution-free, so don’t worry about using it.
It is a photosensitive resin material similar to ABS, with an opaque white appearance and durability. These printed parts can be polished, painted, sprayed, electroplated, and are very close to ABS engineering plastics.
|Technical performance||Test method||Metric|
|Tensile strength||ASTM D638M||45.7 MPa|
|Elongation at break||ASTM D638M||7.9 %|
|Elongation at yield||ASTM D638M||3.5 %|
|Modulus of Elasticity||ASTM D638M||2,460 MPa|
|Poisson’s ratio||ASTM D638M||0.23|
|Bending strength||ASTM D790M||68.9 MPa|
|Bending modulus||ASTM D790M||2,250 MPa|
|Izod impact strength, notch||ASTM D256A||23.5J/cm|
|Graves tearing||ASTM D1004||123,000 N/m|
|Water absorption||ASTM D570-98||0.24 %|
|Technical performance||Test method||Metric|
|C. T. E. -40°C – 0°C||ASTM E831-00||67 μm/m-°C|
|C. T. E. 0°C – 50°C||ASTM E831-00||93μm/m-°C|
|C. T. E. 50°C – 100°C||ASTM E831-00||156 μm/m-°C|
|C. T. E. 100°C – 150°C||ASTM E831-00||180 μm/m-°C|
|Dielectric constant 60Hz||ASTM D150-98||3.9|
|Dielectric constant 1KHz||ASTM D150-98||3.7|
|Dielectric constant 1MHz||ASTM D150-98||3.5|
|Dielectric strength||ASTM D149-97a||31kV/mm|
|Glass transition temperature Tg||ASTM D1545-00||44°C|
|Heat distortion HDT @ 0.46 MPa||ASTM D648-98c||53°C|
|Heat distortion HDT @ 1.81 MPa||ASTM D648-98c||48°C|
*The above photosensitive resin properties are commonly used physical properties. Of course, there are models with high temperature resistance, high hardness and high flexibility to choose from.
*All values are taken from the documentation provided by the manufacturer of the special material. PTJ 3D printing company. No claims are made to the accuracy of these data, as each individual application may vary. If you have any questions, please contact the manufacturer to give specific product information.
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